![]() Device for leak detection and moisture monitoring
专利摘要:
The invention relates to a device for leak detection for buildings comprising an electrical line (7), at which at intervals to each other sensors (8) are arranged to detect moisture, the device is intended to be mounted under a liquid and diffusion-tight layer of a building, and the sensors (8) are capacitive proximity sensors, which are each attached to a printed circuit board, wherein the electrical line (7) interconnects the printed circuit boards and wherein the printed circuit boards are encapsulated completely diffusion-tight with all components thereon including the capacitive proximity sensors. As a result, the device is protected against moisture and moisture in the intended use, regardless of the state of the liquid and diffusion-tight layer of the building. 公开号:AT519544A4 申请号:T50477/2017 申请日:2017-06-07 公开日:2018-08-15 发明作者: 申请人:Roofsec Gmbh; IPC主号:
专利说明:
(54) Device for leak detection and moisture monitoring (57) The invention relates to a device for leak detection for buildings, comprising an electrical line (7), on which sensors (8) for detecting moisture are arranged at intervals from one another, the device being used as intended liquid and diffusion-tight layer of a building is to be attached, and the sensors (8) are capacitive proximity sensors, which are each attached to a printed circuit board, the electrical line (7) connecting the printed circuit boards to one another and the printed circuit boards with all the components thereon including the capacitive proximity sensors are completely sealed against diffusion. As a result, when used as intended, the device is independent of the state of the liquid and diffusion-tight layer of the building Protects moisture and moisture. DVR 0078018 S 2832 The invention relates to a device for leak detection for buildings, comprising an electrical line (7), on which sensors (8) for detecting moisture are arranged at intervals from one another, the device as intended under a and diffusion-tight layer of a building is to be attached, and the sensors (8) are capacitive proximity sensors, each of which is attached to a printed circuit board, the electrical line (7) connecting the printed circuit boards to one another and the printed circuit boards with all the components thereon, including the capacitive proximity sensors, being encapsulated in a completely diffusion-tight manner. As a result, the device is protected against moisture and moisture when used as intended, regardless of the state of the liquid and diffusion-tight layer of the building. / 14 S 2832 Be honored The invention relates to a device for leak detection and moisture monitoring of buildings, comprising an electrical line equipped with encapsulated sensors, which is attached under or above a seal or vapor barrier in the form of liquid and diffusion-tight films on buildings or structures for locating moisture or liquid . Buildings and roof structures, especially flat roofs, can leak due to construction errors or unforeseen mechanical loads when sealing the roof. This damage is often recognized very late, which can lead to larger sums of damage and costly renovations. In order to determine leaks or moisture in roof structures, it is possible to install moisture sensors, for example capacitive sensors, with networked communication units for continuous monitoring of the tightness of the roof. Devices for leak detection and moisture monitoring in roof structures are already sufficiently known from the prior art. US5818340A, DE102011100451A1 and DE102008039857A1, for example, show capacitive moisture sensors for leak detection in flat roofs. The sensors of US5818340A and DE102011100451A1 consist of an LC resonant circuit with a known resonance frequency, a dielectric with a known dielectric constant being located between the plates. If water penetrates, the capacitance of the capacitor and the resonance of the resonant circuit are changed, which means that a leak can be determined. The sensors are located between the vapor barrier and a top layer. This protects the sensors from the environment as long as the roof is intact. It is disadvantageous that water entering the roof layer also penetrates into the sensors, thereby minimizing the useful life of the sensors. 2/14 page 1 S 2832 In DE102008039857A1, a plate capacitor is used as a “sensor” through the outer roof skin (first electrode) and the support shell (second electrode). The insulation, the vapor barrier and the support elements serve as a dielectric. When water enters, a measurable change in the dielectric constant is caused again, whereby water entry can be determined. Since the outer skin of the roof acts as the electrode of the plate capacitor in DE102008039857A1, the service life of the sensor is directly linked to the service life of the roof. In DE3636074A1 sensors are wired or wirelessly connected to a control device. The sensors are attached through holes in the upper sealing layer and the insulating layer in the roof structure. When water enters, this is detected by the sensors by measuring the resistance between exposed contacts and output optically or acoustically by the control device. The disadvantage of this system is that the sensors are attached through bores and are sealed only by attaching between two layers. If the layers are damaged, the tightness of the sensors cannot be guaranteed either. In DE102005049651A1, diffusion-permeable sensors are coupled via a network of electrically conductive connections. Each sensor is arranged in the area of a node of the network and has digital interfaces that can be separately addressed and read out. The disadvantage of this system is that the moisture sensor is permeable to diffusion. This also prevents damage to the sensor from moisture or liquid. The previously known moisture sensors are therefore not or only protected against precipitation, wetness or moisture if the roof is intact. As a result, the service life of the sensors is limited to the durability of the roof. As soon as moisture or liquid penetrates the roof, the sensors can be damaged. 3/14 Page 2 S 2832 The object underlying the invention is to provide a device for leak detection and moisture monitoring of buildings or parts of buildings, which sends a signal to a signaling system after the occurrence of moisture or liquid and is better protected against the ingress of liquid. To solve the problem, it is proposed to provide a sensor for leak detection of buildings which, by encapsulating the sensors or the entire printed circuit board (including the sensor and connection points), protects the electronic components against weather and environmental influences. The encapsulation protects the sensor from the outside world and no liquid or moisture can penetrate. In addition, the separation of the sensors from the closest building layer also enables protection against any mechanical stress. The sensor is a capacitive proximity sensor, which has the advantage over previously used capacitive humidity sensors that it does not measure the change in the dielectric constant inside a capacitor, but the area adjacent to the sensor surface of the proximity sensor. The invention is illustrated by means of drawings: Fig. 1: shows a schematic representation of a typical Flat roof construction. Fig. 2: shows a schematic representation of an inventive attachment of sensors in a flat roof structure. 3: shows a schematic representation of an example Laying pattern of the line according to the invention with encapsulated sensors. 1 shows a schematic drawing of a typical flat roof structure. The top layer is a protective layer 5, which, for example, as 4/14 on 3 S 2832 Gravel or as a green roof can fail. Under the protective layer 5, a seal 4 is attached, which should repel dirt and moisture. Thermal insulation 3 is generally applied under the seal 4. A vapor barrier 2 then follows under the thermal insulation 3, which is intended to prevent the diffusion of moisture from the interior air in the direction of the thermal insulation 3. The vapor barrier 2 lies directly on the substructure 1 of the roof. 2 schematically shows a sectional drawing of an attachment of inventive capacitive sensors on an exemplary flat roof. In this case, under the seal 4, preferably between the thermal insulation 3 and the vapor barrier 2, an electrical line with capacitive sensors attached to it is attached as a sensor layer 6 according to almost any laying pattern. On this electrical line there are printed circuit boards at predefined intervals, on which capacitive measuring sensors and microcontrollers are attached and connected to each other. The connection of the individual capacitive sensors is preferably carried out using a BUS system. The circuit boards are completely encapsulated so that the measuring sensors can have a long service life. The encapsulation is preferably carried out by painting, potting or attaching a shrink tube over the circuit board and the measuring sensors and connection points attached to it. The electrical line with the capacitive sensors attached to it is preferably connected to a communication unit inside the building, to which collected data from the capacitive sensors are sent, which enables remote monitoring of the attached capacitive sensors. The capacitive sensors are remotely monitored in any form, preferably with an internal communication unit, which sends the collected data to a cloud portal via LAN or GSM module and notifies the end user of the occurrence of liquids or moisture in the roof interior. 5/14 page 4 S 2832 3 shows a schematic illustration of an exemplary laying pattern of the sensor cable according to the invention. In this case, an electrical line 7 is provided at a predefined distance, preferably between 0.5 and 2 m, with capacitive sensors 8 and laid in almost any path. The electrical line 7 with the capacitive sensors 8 attached to it is preferably attached under the seal 4, particularly preferably on the vapor barrier 2. After installation, the position of all capacitive sensors 8 is recorded in a central system. In this way, when a moisture ingress is detected, the leak can be localized by reporting a capacitive sensor 8 and specific measures can be taken. A capacitive proximity sensor is used so that the capacitive sensor 8 for the detection of moisture and water does not have to have direct contact with the entering water or the entering moisture. The proximity sensor can be used for the presence of liquids or excessive moisture without direct contact with the capacitive sensor 8. Since air and water have a relative permittivity in the ratio of 1 to 80 (at 20 ° C), the charging or discharging behavior of the capacitive sensor is changed in wet or damp conditions. The electrical discharge behavior is preferably converted into a square-wave signal by means of a Schmitt trigger. The analog square-wave voltage is then preferably converted as a frequency by a microcontroller. If a previously set frequency change in the electrical capacity is exceeded, moisture or liquid entry is signaled. The threshold value of the frequency change in relation to the medium can be calibrated by resistors installed on the printed circuit board, as a result of which the necessary frequency difference in relation to the material thickness of the potting is achieved. The proximity sensor thus detects an increase in moisture in the adjacent material, usually insulating material. Since this takes place through the diffusion-tight encapsulation, the layer thickness of the encapsulation should be kept low. 6/14 page 5 S 2832 To attach the encapsulation, the printed circuit board with the capacitive sensor 8 attached to it must be fully protected. Paint or potting are preferred. In a preferred embodiment variant for encapsulation, each printed circuit board with the capacitive sensor 8 attached to it is placed in a mold and encapsulated on all sides. In this case, a full-area and small layer thickness must be achieved above the measuring surface of the capacitive sensor 8 in order to allow measurement through it. For this purpose, the circuit board with the measuring surface of the sensor is placed at a short distance from an interface of the mold, so that there results a minimum layer thickness, preferably in the range from 25 to 55 μm. The printed circuit board can then be attached to an electrical line 7, but preferably the connection to the electrical line 7 takes place before the potting, so that the connection points are also encapsulated. In a further embodiment variant for encapsulation, the printed circuit board with capacitive sensors 8 attached to it is encapsulated by means of dip coating. The printed circuit boards with the capacitive sensors 8 attached to them are preferably already mounted on the electrical line 7 beforehand. In a preferred embodiment variant, the printed circuit boards are combined into groups, for example 10 printed circuit boards at a defined distance. Subsequently, the electrical line 7 with printed circuit boards attached to it is protected against moisture and liquids by dip coating. A major advantage of this design variant is that several printed circuit boards can be painted at the same time. The layer thickness of the lacquer is in a preferred range of 25-55 pm. In order to protect the coated printed circuit board from mechanical stress, press-in pins are inserted into the board. These are placed in such a way that an acting mechanical force is absorbed by the press-in pins, thereby minimizing the mechanical stress on soldered components. 7/14 page 6 S 2832 In a preferred embodiment variant, clearly identifiable microprocessors are attached to the printed circuit board. With the attached microprocessor, the exact position can be localized and displayed to the user when water or moisture is detected. As a result, in addition to the detection of moisture or moisture ingress, the user is also informed of the specific position of the leak. In a further preferred embodiment variant, a radio transponder is attached to each printed circuit board, as a result of which a large number of radio transponders are present on the installed electrical line 7. The radio transponders communicate with each other, whereby their position is determined by geometric algorithms. The laying of the electrical line 7 or the sensors 8 mounted thereon can thereby be detected fully automatically. In a preferred embodiment variant, the printed circuit board is provided with a visual display, for example an LED display, for status display. This enables each individual board to be visually marked and quickly identified in the event of a fault or service. If an electrical line 7 with attached capacitive sensors 8 is attached, for example, between the vapor barrier 2 and the thermal insulation 3, the sensor surface can be aligned, for example, downward in the direction of the vapor barrier 2, laterally or upward in the direction of the thermal insulation 3. Another possible embodiment is that a plurality of sensors 8 are attached to a printed circuit board and aligned differently. The described device for leak detection and moisture monitoring can be used for all types of roof structures, in particular flat roofs, tiled roofs and sheet metal roofs. It can also be used for other building surfaces and structures, such as walls or structures beneath the earth's surface, such as underground garages. 8/14 Page 7 S 2832
权利要求:
Claims (13) [1] Expectations 1. Leak detection device for buildings, comprising an electrical line (7) on which sensors (8) for detecting moisture are arranged at intervals from one another, the device being intended to be attached under a liquid and diffusion-tight layer of a building, characterized in that that the sensors (8) are capacitive proximity sensors, each of which is attached to a printed circuit board, the electrical line (7) connecting the printed circuit boards to one another and the printed circuit boards with all the components located thereon, including the capacitive proximity sensors, being encapsulated in a completely diffusion-tight manner and thereby in the Intended use is protected from moisture and moisture regardless of the condition of the liquid and diffusion-tight layer of the building. [2] 2. Device according to claim 1, characterized in that the encapsulation is carried out by painting, potting or attaching a shrink tube. [3] 3. Device according to claim 2, characterized in that the encapsulation is by a paint whose layer thickness is in the range of 25 to 55 gm. [4] 4. The device according to claim 1 to 3, characterized in that the printed circuit boards are provided with press-in pins which absorb mechanical forces acting. [5] 5. Device according to one of claims 1 to 4, characterized in that the capacitive sensors (8) are mounted at a distance of 0.5 to 2 m on the electrical line (7). 9/14 to 8 S 2832 [6] 6. The device according to claim 5, characterized in that the capacitive sensors (8) are mounted at a distance of 0.8 to 1.2 m on the electrical line (7). [7] 7. Device according to one of claims 1 to 6, characterized in that the capacitive sensors (8) are connected to one another by data lines. [8] 8. The device according to claim 7, characterized in that the capacitive sensors (8) are connected to a bus system. [9] 9. Device according to one of claims 1 to 8, characterized in that the printed circuit boards have a visual display, preferably LED display. [10] 10. A method for producing a device according to one of claims 1 to 9, characterized in that printed circuit boards with attached capacitive sensors (8) are attached to an electrical line (7) and then coated with a thin layer of lacquer by means of dip coating. [11] 11. Use of the device according to one of claims 1 to 9, characterized in that the electrical line (7) with attached capacitive sensors (8) is attached under the seal (4) of the roof structure. [12] 12. Use according to claim 11, characterized in that the electrical line (7) with attached capacitive sensors (8) between the thermal insulation (3) and the vapor barrier (2) is attached. [13] 13. Use according to one of claims 11 to 12, characterized in that the device is remotely monitored by LAN or GSM module. 10/14 Page 9 2832
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同族专利:
公开号 | 公开日 WO2018223169A1|2018-12-13| EP3635358B1|2021-05-19| AT519544B1|2018-08-15| EP3635358A1|2020-04-15|
引用文献:
公开号 | 申请日 | 公开日 | 申请人 | 专利标题 US5818340A|1996-03-25|1998-10-06|The United States Of America As Represented By The Secretary Of The Army|Roof moisture sensing system and method for determining presence of moisture in a roof stucture| DE102008039857A1|2008-08-27|2010-04-29|Bernd Schröter|Thermally insulated metallic roof and gutter constructions moisture detecting method, involves changing impedance value during entry of humidity into roof construction, and detecting and evaluating change of impedance| DE102011100451A1|2011-04-27|2012-10-31|Gerd Müller|Data transfer apparatus for controlling tightness of industrial building with respect to atmospheric environmental condition, has radio frequency identification sensors to determine water leakage in seal portion of building|DE102018006951A1|2018-09-03|2020-03-05|Ewald Dörken Ag|Construction film|DE3636074A1|1986-10-23|1988-04-28|Klaus Dreizler|Control and signalling system for detecting water penetrating into buildings| DE4024049A1|1990-07-28|1992-02-06|Hermann Nagel|Monitoring sealing of water barriers in building structure - using electrical sensors between inner structure and roof covering connected to evaluation unit| US5343191A|1993-01-08|1994-08-30|Nibco, Inc.|Pipeline leak detection system| DE102005049651A1|2005-10-18|2007-04-26|Materialforschungs- und Prüfanstalt an der Bauhaus-Universität Weimar|Body e.g. roof, surface humidity measuring arrangement for e.g. building, has humidity sensors that are contacted with network of electrically conducting connections, where connections are arranged in form of mesh on surface of body| GB201021033D0|2010-12-13|2011-01-26|Verdirrigation Ltd|An irrigation apparatus and a sensor therefor|
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申请号 | 申请日 | 专利标题 ATA50477/2017A|AT519544B1|2017-06-07|2017-06-07|Device for leak detection and moisture monitoring|ATA50477/2017A| AT519544B1|2017-06-07|2017-06-07|Device for leak detection and moisture monitoring| PCT/AT2018/060115| WO2018223169A1|2017-06-07|2018-06-04|Device for locating leaks and monitoring moisture| EP18752083.8A| EP3635358B1|2017-06-07|2018-06-04|Device for the detection of leaks and monitoring of humidity| 相关专利
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